Ultra-high thermal conductivity, rapidly dissipating concentrated heat spots generated by IGBT switching losses, reducing case temperature and junction-to-case thermal resistance; excellent electrical conductivity with extremely low resistivity, showing no significant voltage drop under high-current conditions; excellent machinability with strong ductility, and strong surface process compatibility, surface can be nickel-plated, nickel-gold plated, or silver-immersed to solve copper oxidation at high temperatures; good heat spreading capability, dispersing localized high temperatures and preventing localized overheating burnout. Application: IGBT copper plates specifically refer to the full-size load-bearing heat dissipation copper plate at the bottom of IGBT power modules, with mainstream substrates manufactured from T2 copper and TU1 oxygen-free copper. Flat polished copper substrates are mainly used in photovoltaics, energy storage converters, industrial frequency converters, servo drives, DC charging piles, and wind power converters, compatible with air-cooled heatsinks and water-cooled cold plates; pin-fin integrated copper substrates are mainly used in new energy vehicles, compatible with direct immersion cooling channels for direct liquid cooling.